AST-3100 Automated Polyimide Cure

A proven 300mm thermal process tool

Designed for automated wafer level processing, the Despatch AST-3100 accommodates both 200mm and 300mmwafers. This automated Polyimide Cure Tool increases throughput and eliminates handling errors while conserving valuable floor space.
Thermal Data - The Despatch AST-3100 Polyimide Cure Tool provides tight temperature uniformity. The tool maintains uniformity of +/-1.0°C within each wafer and throughout all 50 wafers in the thermal chamber at soak.
Increase Throughput, Eliminate Errors, and Improve Ergonomics -Integrating a Brooks Automation wafer handling system eliminates costly errors, improves ergonomics, and boosts throughput. The oven's two chambers each hold up to 50 wafers operating independently through the process cycle. Despatch can add additional heat chambers to increase throughput.
Conserve Valuable Clean Room Space - The AST3100 small footprint will minimize clean room space needed and maximize your production environment. Compatible with either ballroom or bulkhead mounted installations.

Features

Automation Features
Accommodates both 200mm and 300mm wafers
Semiconductor industry standard automation
Four Front Opening Unified Pod (FOUP) load port stations
Atmospheric Class 1 clean room compatible robot
Optically based Class 1 laser cassette mapping sensor
Tool capacity: 100 wafers with standard two-chamber configuration.
Inert atmosphere
350°C maximum operating temperature
Temperature uniformity ±1.0°C at 350°C soak temperature
Active cooling for quick cool down
HEPA filters
Complies with SEMI S2/S8 and SEMATECH appendices A, B, and C
Graphical User Interface (GUI)
Complies with 300mm SEMI communication standards

Options

0 2 level monitoring
Wafer ID reader
Uninterruptible Power Supply (UPS)

Produktaufnahmen

Produktbeschreibung, Optionen und Spezifikationen