CT-150 and CT-200 Polyimide Curing Tool

A proven inert atmosphere process tool

The Despatch Polyimide Curing Tool provides a unique “chamber in a chamber” design that reduces particulate contamination and oxygen concentration while maintaining tight temperature uniformity and fast heating and cooling ramp rates. The tool is designed for manual load/unload of cassettes.

Theory of Operation
Preheated and filtered nitrogen is injected into the curing chamber and flows vertically-down over the wafers to transfer heat and to provide a clean environment.
The inner “curing” chamber has no moving parts and provides a clean as well as low oxygen environment for the wafers.
Exterior heating chamber provides tight temperature airflow uniformities to the inner “curing” chamber, ensuring uniform distribution of heat to the curing chamber and wafers.
Tool concept has been utilized for many years in other high value-added proprietary applications, such as photoresist cross linking in disk drive heads.

Typical Applications

• Curing of polyimide coated wafers
• BCB bake
• Photoresist Cure

Facility requirements

• 80 psig of factory compressed air
• 4 gpm of cooling water
• 10 cfm of nitrogen supply
• 480 or 400 volt - 3 phase power

Features

• 150mm and 200mm wafer capability
• Tight temperature uniformity (±2.5 C° at 400°C)
• Fast ramp rates (5 C°/minute heating and 2.5 C° cooling)
• Low oxygen capability
• Low particulate (Class 100 and better)
• 8 cassette capacity of 150mm wafers and 6 cassette capacity of 200mm wafers
• 450°C maximum operating temperature
• Multiple recipes/controls