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Featuring High Field Strength Superconducting Magnet Despatch’s Magnetic Annealing Tool provides process flexibility and improved yield, enabling recording head manufacturers to make significant advances in product performance. The product features a wide range of field strength options, including superconducting magnets up to 2.0 Tesla. Tight temperature uniformity of +/- 0.5°C across each wafer and within the wafer stack maximize product yield.
Industry Leading Throughput - Despatch’s Magnetic Annealing Tool provides recording head manufacturers with the best overall throughput in the industry, by combining large load capability with excellent temperature ramp-up and cool-down rates. Standard load sizes are 10 wafers per batch for the MT-500 and 15 wafers per batch for the MT-300, and optional configurations can hold as many as 20 wafers per batch. Temperature ramp-up and cool rates of over 5°C per minute allow for shortened cycle times and increased throughput. Despatch Magnetic Annealing Tools maintain their excellent temperature uniformity during the ramp phase of the process cycle.
Increased Yield - Despatch’s patented Magnetic Annealing Tool helps increase recording head yield by maintaining tight tolerances throughout each batch Temperature tolerance within each wafer, and between wafers in a batch, is better than ±0.5% of soak temperature.
The MT-300 maintains temperature uniformity of ±0.5°C, and the MT-500 holds temperature uniformity of ±2.5°C See Figure B Precise magnetic field uniformity is also maintained. Field uniformity is better than ±2% throughout the work area.
The maximum divergence angle is 2 degrees. These tight tolerances lead to excellent lot-to-lot consistency and superior product quality.
Greater Process Flexibility - Despatch’s Magnetic Annealing Tool offers flexibility to recording head process designers. With a wide range of temperatures, magnetic field strengths, wafer rotation, and a variety of material handling options, Despatch’s tools enable head manufacturers to keep pace with rapidly changing technology.
Features
- Model MT-300 Standard Features Superconducting magnet: Field strength 1.7 Tesla standard. Field uniformity ±2% Divergence angle 1.5°
- 15 wafer levels per batch, plus 1 control
- 300°C maximum temperature
- Automatic mass flow controlled back-fill/ inert gas capability
- Temperature uniformity: ±0.5°C
- Standard vacuum system: 10 -5 Torr
- Ramp-up rate: 5°C per minute
- Ramp-down rate: 5°C per minute
- Magenetic shielded enclosures for operator safety
- User friendly graphical interface, featuring real time graphing, alarm monitoring, and SECS/GEM compatibility Model MT-500 Standard Features
- Superconducting magnet: Field strength 1.7 Tesla standard. Field uniformity ±2% Divergence angle 1.5°
- 10 wafers per batch
- 525°C maximum temperature
- Backfill/Inert gas capability
- Temperature uniformity: ±2.5°C
- Standard vacuum system: 10 -5 Torr
- Ramp-up rate: 5°C per minute
- Ramp-down rate: 5°C per minute
- Magnetic shielded enclosures for operator safety
- User friendly graphical interface, featuring real time graphing, alarm monitoring, and SECS/GEM compatibility
Options
- High Vacuum: 10 -7 Torr
- Wide variety of magnet options: - permanent magnet 0.1 to 0.25 Tesla - standard electromagnet to 1.3 Tesla - superconducting electro-magnet to 2.0 Tesla
- Automated wafer loading capability
- Automated wafer rotation; allows wafer orientation relative to magnetic field to be changed during processing. Eliminates manual handling, with associated errors and contamination.
- 200mm wafer size capability
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Produktaufnahmen
Produktbeschreibung, Optionen und Spezifikationen
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