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Thermal resolutions
 On the following pages you will find our standard product series and a selection of custom products. For an overview of the whole range of products including the custom solutions you can download our product catalogue here.
If you already have detailed knowledge of the parameters and the scope of the process, you can use our product search .
You are Looking for a new thermal process or a product with special specifications? Then use our request form . With the help of your technical requirements, we will find the thermal solution which will directly fit your needs.
Of course you are always welcome to contact us directly at any time. Simply use our contact form or give us a call.
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RA Series Ovens
These ovens feature horizontal recirculating airflow with exceptional temperature uniformity, user-friendly controls, and small footprint. Replaces the VRC and VRD ovens for class B applications.
- Sterilization
- Drying
- Curing
- Annealing
- Aging
Min. Temperature: 343 °C
Capacity: bis zu 991 Liter
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RF Series Ovens
These Class A ovens are specially designed to meet NFPA 86 requirements for applications that include flammable solvents. Replaces the VRC and VRD ovens for class A applications.
- Sterilization
- Drying
- Curing
- Annealing
- Aging
Min. Temperature: 537 °C
Capacity: bis zu 991 Liter
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PTC Top-Loading Ovens
For burn-in and qualification testing of down-hole electronic logging equipment. The PTC ovens offer high performance in a configuration well suited for heating long and narrow loads such as tubing and extrusions. The forcedair convected ovens feature horizontal airflow with adjustable louvers to assure uniform airflow even with varying load conditions.
- Testing
- Pre-Heating
- Laboratory Testing
- Baking
Atmosphere/ Environment:
Min. Temperature: 260 °C
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Custom Products
The low-risk choice for your complex challenges
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PBC and PNC Burn In Chambers
Despatch burn-in ovens are engineered specifically for applications such as highdissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of IC’s, RAM’s, ROM’s, microprocessors and other semiconductor devices.
Atmosphere/ Environment:
Min. Temperature: 260 °C
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RBC Stackable Burn In Chambers
Despatch’s stackable burn-in chambers offer maximum flexibility for small lot qualification testing, burn-in, reliability testing, and research and development.
Atmosphere/ Environment:
Min. Temperature: 260 °C
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900E Series Benchtop Temperature Chambers
The 900E Series chambers are designed for high and low temperature simulation where high performance and close temperature tolerance are required.
- Environmental Testing
- Baking
Min. Temperature: -73 bis 274 °C
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AST-1100 Automated Photoresist Bake Tool
Using semiconductor industry standard automation, the AST-1100 accommodates both 200mm and 300mm wafers. The tool increases throughput and conserves valuable floorspace.
Atmosphere/ Environment:
Min. Temperature: 175 °C
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AST-3100 Automated Polyimide Cure
The AST3100 accommodates 200mm and 300mm wafer while doubling the throughput and high temperature range of the AST1100.
Atmosphere/ Environment:
Min. Temperature: 350 °C
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CT-150 and CT-200 Polyimide Curing Tool
The CT-150 and CT-200 Polyimide Curing Tools provide a unique "chamber in a chamber" design that reduces particulate contamination and oxygen concentration. Despatch's Polyimide Curing Tools deliver industry-leading performance in temperature uniformity for improved yield in electronic packaging applications, including both device-level packaging and wafer level packaging.
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