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Thermal resolutions

Bench Ovens/ Laboratory Ovens (7/- )

Burn-in Chambers (3/- )

Clean Process Batch Ovens (10/- )

 
PBC and PNC Burn In Chambers

PBC and PNC Burn In Chambers

Despatch burn-in ovens are engineered specifically for applications such as highdissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of IC’s, RAM’s, ROM’s, microprocessors and other semiconductor devices.
  • Baking
Atmosphere/ Environment:
  • Air
Min. Temperature: 260 °C
RBC Stackable Burn In Chambers

RBC Stackable Burn In Chambers

Despatch’s stackable burn-in chambers offer maximum flexibility for small lot qualification testing, burn-in, reliability testing, and research and development.
  • Baking
Atmosphere/ Environment:
  • Air
Min. Temperature: 260 °C
900E Series Benchtop Temperature Chambers

900E Series Benchtop Temperature Chambers

The 900E Series chambers are designed for high and low temperature simulation where high performance and close temperature tolerance are required.
  • Environmental Testing
  • Baking
Min. Temperature: -73 bis 274 °C
AST-1100 Automated Photoresist Bake Tool

AST-1100 Automated Photoresist Bake Tool

Using semiconductor industry standard automation, the AST-1100 accommodates both 200mm and 300mm wafers. The tool increases throughput and conserves valuable floorspace.
  • Ausbacken
Atmosphere/ Environment:
  • Inert
Min. Temperature: 175 °C
AST-3100 Automated Polyimide Cure

AST-3100 Automated Polyimide Cure

The AST3100 accommodates 200mm and 300mm wafer while doubling the throughput and high temperature range of the AST1100.
  • Ausbacken
Atmosphere/ Environment:
  • Inert
Min. Temperature: 350 °C
CT-150 and CT-200 Polyimide Curing Tool

CT-150 and CT-200 Polyimide Curing Tool

The CT-150 and CT-200 Polyimide Curing Tools provide a unique "chamber in a chamber" design that reduces particulate contamination and oxygen concentration. Despatch's Polyimide Curing Tools deliver industry-leading performance in temperature uniformity for improved yield in electronic packaging applications, including both device-level packaging and wafer level packaging.
  • Curing
SD Sterilization and Depyrogenation Ovens

SD Sterilization and Depyrogenation Ovens

These cGMP compliant ISO Class 5 ovens feature the fastest heat-up rates and shortest cycle times available. A comprehensive IQ,OQ and SQ validation package is available. Isolator integration is optional.
  • Sterilization
  • Depyrogenation
Atmosphere/ Environment:
  • Air
Min. Temperature: 320 °C
GW Series Granulation Dryers

GW Series Granulation Dryers

Designed for drying pharmaceutical materials, these ovens create Class 100 conditions and comply with all cGMPs. They feature a unique horizontal airflow pattern for rapid, even drying without crusting.
  • Drying
Atmosphere/ Environment:
  • Air
Min. Temperature: 180 °C
Tool Conditioning Oven

Tool Conditioning Oven

The Despatch Tool Conditioning Oven keeps semiconductor parts and tooling clean, dry, and ready for immediate installation. It is specifically designed for atmosphere controlled storage of parts, tooling, and deposition targets. Min. Temperature: 95 °C
UV-360 Ultraviolet Decontamination Chambers

UV-360 Ultraviolet Decontamination Chambers

These ultraviolet chambers provide a 6-log reduction in bioburden on materials entering a sterile room or barrier isolator. The unique, patented design ensures that all surfaces are exposed to a germicidal wavelength of ultraviolet energy.
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