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Thermal resolutions
PBC and PNC Burn In Chambers
Despatch burn-in ovens are engineered specifically for applications such as highdissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of IC’s, RAM’s, ROM’s, microprocessors and other semiconductor devices.
Atmosphere/ Environment:
Min. Temperature: 260 °C
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RBC Stackable Burn In Chambers
Despatch’s stackable burn-in chambers offer maximum flexibility for small lot qualification testing, burn-in, reliability testing, and research and development.
Atmosphere/ Environment:
Min. Temperature: 260 °C
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900E Series Benchtop Temperature Chambers
The 900E Series chambers are designed for high and low temperature simulation where high performance and close temperature tolerance are required.
- Environmental Testing
- Baking
Min. Temperature: -73 bis 274 °C
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