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LCC/ LLC/ LCD/ LLD Stackable Clean Process Oven

LCC/ LLC/ LCD/ LLD Stackable Clean Process Oven

For production environment processes where minimal contamination is essential, the LCC and LCD Series ovens offer the highest standards in HEPA filtration. Re-circulated airflow is 100% HEPA filtered for operation at ISO Class 5 (Class 100) or better within the oven chamber. Silicone free models available.
  • Sterilization
  • Depyrogenation
  • Curing
Atmosphere/ Environment:
  • Inert
  • Clean Process
  • Air
Min. Temperature: 350 °C
Capacity: bis zu 144 Liter
LCC2-14 Clean Process Oven

LCC2-14 Clean Process Oven

Despatch’s 14 cubic foot clean process ovens are designed to meet the demands of production and large scale R&D environments. A variety of tailored options are available to meet your specific needs. Maximum temperatures of 260°C or 350°C, HEPA filtration, Air, Class A or Nitrogen atmospheres and pass-through models are available.
  • Drying
  • Depyrogenation
  • Curing
Atmosphere/ Environment:
  • Inert
  • Clean Process
  • Air
Min. Temperature: 350 °C
Capacity: bis zu 396 Liter
AST-1100 Automated Photoresist Bake Tool

AST-1100 Automated Photoresist Bake Tool

Using semiconductor industry standard automation, the AST-1100 accommodates both 200mm and 300mm wafers. The tool increases throughput and conserves valuable floorspace.
  • Ausbacken
Atmosphere/ Environment:
  • Inert
Min. Temperature: 175 °C
AST-3100 Automated Polyimide Cure

AST-3100 Automated Polyimide Cure

The AST3100 accommodates 200mm and 300mm wafer while doubling the throughput and high temperature range of the AST1100.
  • Ausbacken
Atmosphere/ Environment:
  • Inert
Min. Temperature: 350 °C
CT-150 and CT-200 Polyimide Curing Tool

CT-150 and CT-200 Polyimide Curing Tool

The CT-150 and CT-200 Polyimide Curing Tools provide a unique "chamber in a chamber" design that reduces particulate contamination and oxygen concentration. Despatch's Polyimide Curing Tools deliver industry-leading performance in temperature uniformity for improved yield in electronic packaging applications, including both device-level packaging and wafer level packaging.
  • Curing
SD Sterilization and Depyrogenation Ovens

SD Sterilization and Depyrogenation Ovens

These cGMP compliant ISO Class 5 ovens feature the fastest heat-up rates and shortest cycle times available. A comprehensive IQ,OQ and SQ validation package is available. Isolator integration is optional.
  • Sterilization
  • Depyrogenation
Atmosphere/ Environment:
  • Air
Min. Temperature: 320 °C
GW Series Granulation Dryers

GW Series Granulation Dryers

Designed for drying pharmaceutical materials, these ovens create Class 100 conditions and comply with all cGMPs. They feature a unique horizontal airflow pattern for rapid, even drying without crusting.
  • Drying
Atmosphere/ Environment:
  • Air
Min. Temperature: 180 °C
Tool Conditioning Oven

Tool Conditioning Oven

The Despatch Tool Conditioning Oven keeps semiconductor parts and tooling clean, dry, and ready for immediate installation. It is specifically designed for atmosphere controlled storage of parts, tooling, and deposition targets. Min. Temperature: 95 °C
UV-360 Ultraviolet Decontamination Chambers

UV-360 Ultraviolet Decontamination Chambers

These ultraviolet chambers provide a 6-log reduction in bioburden on materials entering a sterile room or barrier isolator. The unique, patented design ensures that all surfaces are exposed to a germicidal wavelength of ultraviolet energy.
Magnetic Vacuum Annealing Ovens

Magnetic Vacuum Annealing Ovens

These ovens were developed for photo resist curing and the magnetic-annealing processes required in the production of disk drive recording heads. They provide a tight level of process control and monitoring, plus flexibility for a wide variety of applications.
  • Annealing
Atmosphere/ Environment:
  • Vacuum
  • Magnetic Field
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