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Thermal resolutions
900E Series Benchtop Temperature Chambers
The 900E Series chambers are designed for high and low temperature simulation where high performance and close temperature tolerance are required.
- Environmental Testing
- Baking
Min. Temperature: -73 bis 274 °C
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Ransco Fast Rate Chambers
Designed to meet the specific needs of the semiconductor, electronic devices and healthcare industry through accelerated temperature change rates for product under test and high volume air throughout the test area. 15°C to 20°C per minute heat up or cool down rates with horizontal air flow.
- Environmental Testing
- Baking
Atmosphere/ Environment:
Min. Temperature: -70 bis 177 °C
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Ransco Thermal Shock Chambers-RTS
Designed for accelerated life cycle testing of semiconductor and electronic devices. Single load or double load capacity allows all tested devices to undergo the same temperature cycle conditions, cycle after cycle. Uniform horizontal airflow insures proper heat transfer, excellent thermal gradient, and the rapid temperature recovery rates critical for maximum throughput and proper test performance. Performs to MIL STD 883C and JESD22.
- Thermal Shock
- Temp Cycling
- Environmental Testing
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